Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10397187
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Filing Dt:
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03/27/2003
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Publication #:
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Pub Dt:
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11/13/2003
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Inventors:
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Hirofumi Seki, Katsumi Tokiguchi
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Title:
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Wafer processing method and ion implantation apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6, KANDA SURUGADAI 4-CHOME CHIYODA-KU |
TOKYO, JAPAN |
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24-14, NISHISHIMBASHI 1-CHOME |
MINATO-KU |
TOKYO, JAPAN |
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MATTINGLY, STANGER & MALUR, P.C. |
JOHN R. MATTINGLY |
1800 DIAGONAL ROAD, SUITE 370 |
ALEXANDRIA, VA 22314 |
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