Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/27/2004
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Application #:
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10392851
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Filing Dt:
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03/21/2003
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Publication #:
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Pub Dt:
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11/20/2003
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Inventors:
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Su Tao, Kuo Chung Yee, Jen Chieh Kao, Chih Lung Chen, Hsing Jung Liau
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Title:
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MULTICHIP WAFER-LEVEL PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD RD. |
| NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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| LOWE HAUPTMAN GILMAN, & BERNER |
| BENJAMIN J. HAUPTMAN |
| 1700 DIAGONAL ROAD |
| SUITE 300 |
| ALEXANDRIA, VA 22314 |
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