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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/25/2005
Application #:
10438411
Filing Dt:
05/15/2003
Publication #:
Pub Dt:
11/20/2003
Inventors:
Xian-Li Yeh, Gang Paul Chen
Title:
PACKAGING FOR HIGH POWER PUMP LASER MODULES
Assignment: 1
Reel/Frame:
014095/0981Recorded: 05/15/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/14/2003
Exec Dt:
05/14/2003
Assignee:
1335 W. FOOTHILL BLVD.
AZUSA, CALIFORNIA 91702
Correspondent:
FULBRIGHT & JAWORSKI LLP
JOHN M. MAY
865 SO. FIGUEROA ST., 29TH FLOOR
LOS ANGELES, CA 90017-2576

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