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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	10167824	Filing Dt:	06/12/2002
Publication #:	20030230796	Pub Dt:	12/18/2003
Inventors:	Aminuddin Ismail, Lan Chu Tan, Kong Bee Tiu, Cheng Choi Yong
Title:	Stacked die semiconductor device

Assignment: 1

Reel/Frame:

013012/0349

Recorded: 06/12/2002

Pages: 3

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

ISMAIL, AMINUDDIN

Exec Dt:

05/15/2002

TAN, LAN CHU

Exec Dt:

05/15/2002

TIU, KONG BEE

Exec Dt:

05/15/2002

CHENG, CHOI YONG

Exec Dt:

05/15/2002

Assignee:

MOTOROLA, INC.

LAW DEPARTMENT

1303 EAST ALGONQUIN ROAD

SCHAUMBURG, ILLINOIS 60196

Correspondent:

MOTOROLA, INC.

MARK J. FINK

LAW DEPARTMENT

3102 NORTH 56TH STREET, MAILDROP 56-238

PHOENIX, AZ 85018

Assignment: 2

Reel/Frame:

013575/0396

Recorded: 12/16/2002

Pages: 6

Conveyance:

RECORD TO CORRECT 4TH ASSIGNOR'S NAME. DOCUMENT PREVIOUSLY RECORDED ON REEL 013012 FRAME 0349. ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST.

Assignors:

ISMAIL, AMINUDDIN

Exec Dt:

11/26/2002