Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10175732
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Filing Dt:
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06/20/2002
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Publication #:
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Pub Dt:
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12/25/2003
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Inventors:
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Chung-Che Tsai, Wei-Heng Shan
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Title:
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Strengthened bonding mechanism for semiconductor package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SCIENCE-BASE INDUSTRIAL PARK |
2, LI-HSIN ROAD 3 |
HSINCHU, TAIWAN R.O.C |
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EDWARDS & ANGELL, LLP |
PETER F. CORLESS |
P.O. BOX 9169 |
BOSTON, MA 02290 |
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