Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10327893
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Filing Dt:
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12/26/2002
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Publication #:
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Pub Dt:
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01/01/2004
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Inventors:
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Jui-chung Lee, Chen-Jung Tsai, Chih-Wen Lin
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Title:
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Semiconductor package body having a lead frame with enhanced heat dissipation
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 16, LI-HSIN ROAD |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN |
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BIRCH, STEWART, KOLASCH ET AL. |
JOE MCKINNEY MUNCY |
P.O. BOX 747 |
FALLS CHURCH, VA 22040-0747 |
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