Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10314065
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Filing Dt:
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12/05/2002
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Publication #:
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Pub Dt:
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01/08/2004
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Inventors:
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Chung-Che Tsai, Jin-Chuan Bai, Huan-Ping Su
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Title:
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Semiconductor package with reinforced substrate and fabrication method of the substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| ANDERSON KILL & OLICK, P.C. |
| EUGENE LIEBERSTEIN |
| 1251 AVENUE OF THE AMERICAS |
| 42ND FLOOR |
| NEW YORK, NY 10020 |
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