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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10327933
Filing Dt:
12/26/2002
Publication #:
Pub Dt:
01/15/2004
Inventors:
Moon Bong Ahn, Kwang Cheol Cho
Title:
Electrode forming method in circuit device and chip package and multilayer board using the same
Assignment: 1
Reel/Frame:
013617/0927Recorded: 12/26/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/16/2002
Exec Dt:
12/16/2002
Assignee:
314 MAETAN-3-DONG, PALDAL-KU
SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Correspondent:
LOWE HAUPTMAN GILMAN & BERNER
RANDY A. NORANBROCK
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA, VA 22314

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