Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/03/2004
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Application #:
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10205692
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Filing Dt:
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07/26/2002
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Publication #:
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Pub Dt:
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01/29/2004
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Inventors:
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Harry M. Siegel, Anthony M. Chiu
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Title:
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METHOD OF MAKING AN IC PACKAGE HAVING A TEMPORARY ADHESIVE LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1310 ELECTRONICS DRIVE |
CARROLLTON, TEXAS 75006 |
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STMICROELECTRONICS, INC. |
LISA K. JORGENSON |
1310 ELECTRONICS DR. |
MS 2346 |
CARROLLTON, TX 75006 |
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