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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6896304
Issue Dt:
05/24/2005
Application #:
10234068
Filing Dt:
09/03/2002
Publication #:
20040041421
Pub Dt:
03/04/2004
Inventors:
Yi-Li Hsiao, Chin-Hsin Peng, Cheng-Shun Chan, Jiann-Sheng Chang, Chung-Hao Tseng et al
Title:
AUTOMATIC SENSING WAFER BLADE AND METHOD FOR USING
Assignment: 1
Reel/Frame:
013260/0464Recorded: 09/03/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HSIAO, YI-LI
Exec Dt:
07/10/2002
PENG, CHIN-HSIN
Exec Dt:
07/10/2002
CHAN, CHENG-SHUN
Exec Dt:
07/10/2002
CHANG, JIANN-SHENG
Exec Dt:
07/10/2002
TSENG, CHUN-HAO
Exec Dt:
07/10/2002
HUANG, CHIEN-LING
Exec Dt:
07/10/2002
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 121 PARK AVENUE 3
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN R.O.C.
Correspondent:
TUNG & ASSOCIATES
RANDY W. TUNG
838 W. LONG LAKE ROAD
SUITE 120
BLOOMFIELD HILLS, MI 48302
Assignment: 2
Reel/Frame:
055632/0971Recorded: 03/18/2021Pages: 12
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SHAWCOR LTD.
Exec Dt:
10/28/2020
Assignee:
THE TORONTO-DOMINION BANK, AS AGENT
66 WELLLINGTON STREET WEST
9TH FLOOR
TORONTO, CANADA M5K 1A2
Correspondent:
THOMPSON COBURN LLP/WILLIAM A. HOLTZ
ONE US BANK PLAZA
ST. LOUIS, MO 63101

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