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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/26/2008
Application #:
10233117
Filing Dt:
08/30/2002
Publication #:
Pub Dt:
03/04/2004
Inventors:
Wesley Harrison, Roland Vandamme, David Gore
Title:
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER INCLUDING BACK SIDE GRINDING
Assignment: 1
Reel/Frame:
013465/0602Recorded: 11/07/2002Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/30/2002
Exec Dt:
08/30/2002
Exec Dt:
10/24/2002
Assignee:
7200 N.W. FRONT AVENUE
PORTLAND, OREGON 97210
Correspondent:
KOLISCH, HARTWELL, DICKINSON ET AL
OWEN W. DUKELOW
520 S.W. YAMHILL STREET, SUITE 200
PORTLAND, OREGON 97204
Assignment: 2
Reel/Frame:
015253/0518Recorded: 04/23/2004Pages: 3
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/15/2004
Assignee:
7200 N.W. FRONT AVENUE
MS: 50
PORTLAND, OREGON 97210-3676
Correspondent:
KOLISCH HARTWELL, P.C.
OWEN W. DUKELOW
520 S.W. YAMHILL STREET, SUITE 200
PORTLAND, OR 97204

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