Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/2005
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Application #:
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10396330
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Filing Dt:
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03/26/2003
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Publication #:
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Pub Dt:
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03/11/2004
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Inventors:
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Kwun Yao Ho, Moriss Kung
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Title:
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HIGH DENSITY INTEGRATED CIRCUIT PACKAGES AND METHOD FOR THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F, NO. 533, CHUNG-CHENG RD., HSIN-TIEN |
| TAIPEI, TAIWAN R.O.C. |
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| NATH & ASSOCIATES PLLC |
| HAROLD L. NOVICK |
| 1030 SIXTEENTH ST., N.W., SIXTH FLOOR |
| WASHINGTON, DC 20005 |
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