Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/14/2004
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Application #:
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10452488
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Filing Dt:
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05/30/2003
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Publication #:
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Pub Dt:
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03/25/2004
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Inventors:
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Han-Ping Pu, Chien-Ping Huang, Chih-Ming Huang
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Title:
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FABRICATION METHOD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3 DA FONG ROAD TANTZU |
TAICHUNG, TAIWAN R.O.C. |
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THE LAW OFFICES OF MIKIO ISHIMARU |
MIKIO ISHIMARU |
1110 SUNNYVALE-SARATOGA RD., SUITE A1 |
SUNNYVALE, CA 94087 |
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Assignment:
2
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DOCUMENT PREVIOUSLY RECORDED AT REEL/FRAME 014023/
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NO. 123, SEC. 3, DA FONG ROAD TANTZU |
TAICHUNG, TAIWAN R.O.C. |
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THE LAW OFFICES OF MAKIO ISHIMARU |
MIKIO ISHIMARU |
1110 SUNNYVALE-SARATOGA RD. |
SUITE A1 |
SUNNYVALE, CA 94087 |
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