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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/19/2005
Application #:
10271284
Filing Dt:
10/15/2002
Publication #:
Pub Dt:
04/15/2004
Inventors:
Paul S. Ho, Ki-Don Lee, Ennis Ogawa, Hideki Matsuhashi
Title:
MULTIPLE COPPER VIAS FOR INTEGRATED CIRCUIT METALLIZATION AND METHODS OF FABRICATING SAME
Assignment: 1
Reel/Frame:
013393/0446Recorded: 10/15/2002Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/02/2002
Exec Dt:
10/02/2002
Exec Dt:
10/05/2002
Exec Dt:
10/08/2002
Assignee:
201 WEST SEVENTH STREET
AUSTIN, TEXAS 78701-2902
Correspondent:
MYERS BIGEL SIBLEY ET AL.
MITCHELL S. BIGEL
P.O. BOX 37428
RALEIGH, NC 27627

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