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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/25/2005
Application #:
10377545
Filing Dt:
02/27/2003
Publication #:
Pub Dt:
04/29/2004
Inventors:
Chien Ping Huang, Chih-Ming Huang, Jui-Yu Chuang, Lien-Chi Chan
Title:
WINDOW-TYPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH LEAD FRAME AS CHIP CARRIER AND METHOD FOR FABRICATING THE SAME
Assignment: 1
Reel/Frame:
013829/0763Recorded: 02/27/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/29/2002
Exec Dt:
11/29/2002
Exec Dt:
11/29/2002
Exec Dt:
11/29/2002
Assignee:
NO. 123, SEC. 3, DA FONG ROAD
TANTZU, TAICHUNG, TAIWAN R.O.C.
Correspondent:
EDWARDS & ANGELL, LLP
PETER F. CORLESS
P.O. BOX 9169
BOSTON, MA 02209

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