Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10694955
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Filing Dt:
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10/29/2003
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Publication #:
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Pub Dt:
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05/06/2004
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Inventor:
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Dae Sung Seo
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Title:
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Micro leadframe package having oblique etching
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 483 BEOPHEUNG-RI, TANHYUN-MYUN |
| PAJU-CITY KYUNGKI-DO, KOREA, REPUBLIC OF |
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| ROTHWELL, FIGG, ERNST & MANBECK |
| THOMAS E. MCKIERNAN |
| 1425 K STREET, N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20005 |
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