Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/04/2008
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Application #:
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10319211
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Filing Dt:
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12/13/2002
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Publication #:
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Pub Dt:
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05/06/2004
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Inventors:
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Jui-Yu Chuang, Lien-Chi Chan, Chih-Ming Huang
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Title:
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SEMICONDUCTOR PACKAGE WITH LEAD FRAME AS CHIP CARRIER AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN R.O.C. |
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| EDWARDS & ANGELL, LLP |
| PETER F. CORLESS |
| 101 FEDERAL STREET |
| BOSTON, MA 02110 |
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