Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/31/2004
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Application #:
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10358251
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Filing Dt:
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02/05/2003
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Publication #:
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Pub Dt:
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05/20/2004
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Inventors:
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Kuei-Jung Chen, Meng-Chun Chen, Chih-Yi Lai
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Title:
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CUTTING DEVICE FOR BREAKING FRAGILE MATERIALS SUCH AS SEMICONDUCTOR WAFERS OR THE LIKE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195 CHUNG HSING RD., SEC.4, CHUTUNG |
| HSINCHU, TAIWAN R.O.C. |
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| RABIN & CHAMPAGNE, PC |
| 1101 14TH STREET, NW |
| SUITE 500 |
| WASHINGTON, DC 20005 |
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