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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10468425
Filing Dt:
08/18/2003
Publication #:
Pub Dt:
05/20/2004
PCT #:
US0209118
Inventor:
Toshiaki Ogiwara
Title:
Composition for filling through-holes in printed wiring boards
Assignment: 1
Reel/Frame:
013901/0068Recorded: 08/22/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/28/2002
Assignee:
BARLEY MILL PLAZA 25
LEGAL PATENTS
WILMINGTON, DELAWARE 19880-0025
Correspondent:
E. I. DU PONT DE NEMOURS AND COMPANY
LOIS A. SANTOPIETRO
LEGAL-PATENTS
BARLEY MILL PLAZA 25
WILMINGTON, DE 19880-0025

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