Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10720579
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Filing Dt:
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11/24/2003
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Publication #:
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Pub Dt:
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06/03/2004
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Inventors:
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Sangyum Kim, Chang Hee Choi, Cha Jae Jo, Jeong Ik Kim, Hong Gi Moon, Kyung Nyung Woo et al
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Title:
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Method for manufacturing very low roughness electrodeposited copper foil and electrodeposited copper foil manufactured thereby
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20, YOIDO-DONG |
| YONGDUNGPO-KU 150-010 SEOUL, KOREA, REPUBLIC OF |
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| HARRISON & EGBERT |
| 412 MAIN STREET, 7TH FLOOR |
| HOUSTON, TX 77002 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| #159, SAMSEONG-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| JONES DAY |
| 222 EAST 41ST STREET |
| NEW YORK CITY, NY 10017-6702 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| #1026-6 HOGYE-DONG, DONG-AN-GU, ANYANG-CITY |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| JONES DAY |
| 222 EAST 41ST STREET |
| NEW YORK CITY, NY 10017-6702 |
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