Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/08/2005
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Application #:
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10620745
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Filing Dt:
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07/15/2003
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Publication #:
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Pub Dt:
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06/10/2004
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Inventors:
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Hyun-Ho Kim, Young-Kyun Sun, Kyoung-Bok Cho, Sung-Bok Hong
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Title:
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IN-LINE DIE ATTACHING AND CURING APPARATUS FOR A MULTI-CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, PALDAL-GU |
| SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| ALAN T. MCCOLLOM |
| 1030 S.W. MORRISON STREET |
| PORTLAND, OREGON 97205 |
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