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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/28/2006
Application #:
10728544
Filing Dt:
12/04/2003
Publication #:
Pub Dt:
06/17/2004
Inventors:
Byoung-Jun Min, Jeong-Ho Bang, Hyun-Seop Shim, Hyo-Geun Chae
Title:
TEST KIT FOR SEMICONDUCTOR PACKAGE AND METHOD FOR TESTING SEMICONDUCTOR PACKAGE USING THE SAME
Assignment: 1
Reel/Frame:
014800/0366Recorded: 06/29/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/26/2003
Exec Dt:
11/26/2003
Exec Dt:
11/26/2003
Exec Dt:
11/27/2003
Assignee:
416 MAETAN-DONG, YEONGTONG-GU
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Correspondent:
MARGER JOHNSON & MCCOLLOM, P.C.
1030 S.W. MORRISON STREET
PORTLAND, OR 97205

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