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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/13/2005
Application #:
10720514
Filing Dt:
11/25/2003
Publication #:
Pub Dt:
06/17/2004
Inventors:
Masahiro Sunohara, Kei Murayama, Naohiro Mashino, Mitsutoshi Higashi
Title:
ELECTRONIC PARTS PACKAGING STRUCTURE HAVING MUTUALLY CONNECTED ELECTRONIC PARTS THAT ARE BURIED IN A INSULATING FILM
Assignment: 1
Reel/Frame:
014746/0305Recorded: 11/25/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/10/2003
Exec Dt:
11/10/2003
Exec Dt:
11/10/2003
Exec Dt:
11/10/2003
Assignee:
80, OSHIMADA-MACHI, NAGANO-SHI
NAGANO 381-2287, JAPAN
Correspondent:
ARMSTRONG, KRATZ, QUINTOS, HANSON & BROO
1725 K STREET, NW
SUITE 1000
WASHINGTON, DC 20006
Domestic rep:

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