Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10736486
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Filing Dt:
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12/15/2003
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Publication #:
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Pub Dt:
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07/01/2004
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Inventor:
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Daniel Wang
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Title:
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High density integrated circuits and the method of packaging the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 AMBER STREET |
| UNT 1 |
| MARKHAM, ONTARIO, CANADA L3R 3B3 |
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| DANIEL A. SCOLA |
| HOFFMANN & BARON |
| 6900 JERICHO TURNPIKE |
| SYOSSET, NY 07054 |
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