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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	6989198	Issue Dt:	01/24/2006	Application #:	10684743	Filing Dt:	10/14/2003
Publication #:	20040126523	Pub Dt:	07/01/2004
Inventors:	Haruhisa Masuda, Yuji Munesawa, Koichi Warino, Tomoharu Nishioka, Yoshiro Iwata et al
Title:	MULTI-LAYER STRUCTURE

Assignment: 1

Reel/Frame:

014894/0446

Recorded: 01/12/2004

Pages: 2

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

MASUDA, HARUHISA

Exec Dt:

12/16/2003

MUNESAWA, YUJI

Exec Dt:

12/16/2003

WARINO, KOICHI

Exec Dt:

12/16/2003

NISHIOKA, TOMOHARU

Exec Dt:

12/16/2003

IWATA, YOSHIRO

Exec Dt:

12/16/2003

NAKAMURA, KOJI

Exec Dt:

12/16/2003

TAMURA, KOZO

Exec Dt:

12/16/2003

HARA, TETSUYA

Exec Dt:

12/16/2003

Assignees:

KURARAY CO., LTD.

1621, SAKAZU, KURASHIKI-SHI

OKAYAMA 710-8622, JAPAN

UBE INDUSTRIES, LTD.

1978-96 O-AZA KOGUSHI, UBE-SHI

YAMAGUCHI-KEN 755-8633, JAPAN

Correspondent:

PIPER RUDNICK LLP

T. DANIEL CHRISTENBURY

3400 TWO LOGAN SQUARE

18TH AND ARCH STREETS

PHILADELPHIA, PA 19103-2762

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