Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/06/2005
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Application #:
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10693896
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Filing Dt:
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10/28/2003
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Publication #:
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Pub Dt:
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07/01/2004
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Inventors:
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Jau-Shoung Chen, Su Tao
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Title:
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WAFER BUMPING PROCESS WITH SOLDER BALLS BONDED TO UNDER BUMP METALLURGY LAYER FORMED OVER ACTIVE SURFACE BY FORMING FLUX ON SOLDER BALL SURFACES AND REFLOWING THE SOLDER
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 CHIN 3RD RD. |
NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C. |
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BACON & THOMAS, PLLC |
EUGENE MAR |
625 SLATERS LANE |
FOURTH FLOOR |
ALEXANDRIA, VA 22314 |
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