Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/04/2006
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Application #:
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10353554
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Filing Dt:
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01/29/2003
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Publication #:
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Pub Dt:
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07/29/2004
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Inventors:
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Tai-Chun Huang, Tze-Liang Lee
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Title:
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BONDING PAD AND VIA STRUCTURE DESIGN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 121 PARK AVE. 3 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| GEORGE O. SAILE |
| 28 DAVIS AVENUE |
| POUGHKEEPSIE, NEW YORK 12603 |
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