Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/02/2005
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Application #:
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10756734
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Filing Dt:
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01/12/2004
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Publication #:
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Pub Dt:
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07/29/2004
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Inventors:
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Chun-Chi Chen, Chin Hsien Lan, Meng Fu
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Title:
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HEAT DISSIPATION ASSEMBLY INCLUDING HEAT SINK AND FAN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66 CHUNG SHAN ROAD |
| TU-CHEN TAIPEI HSIEN, TAIWAN |
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| FOXCONN INTERNATIONAL INC. |
| WEI TE CHUNG |
| 1650 MEMOREX DRIVE |
| SANTA CLARA, CA 95050 |
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