Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10758371
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Filing Dt:
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01/15/2004
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Publication #:
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Pub Dt:
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08/05/2004
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Inventors:
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Shukichi Takii, Satoshi Ootsuki, Jinichi Noguchi, Susumu Sakuragi, Hiroyuki Makino et al
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Title:
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Multi-layer circuit board and method for manufacturing same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-3, SHIMBASHI 5-CHOME, MINATO-KU |
| TOKYO 105-8716, JAPAN |
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| 9-11, KITASHINAGAWA 5-CHOME, SHINAGAWA-KU |
| TOKYO 141-8686, JAPAN |
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU |
| TOKYO 140-0002, JAPAN |
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| SMITH, GAMBRELL & RUSSELL, LLP |
| ROBERT G. WEILACHER, ESQ. |
| 1230 PEACHTREE STREET, N.E. |
| SUITE 3100, PROMENADE II |
| ATLANTA, GA 30309-3592 |
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