Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/20/2008
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Application #:
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10747108
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Filing Dt:
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12/30/2003
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Publication #:
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Pub Dt:
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08/05/2004
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Inventor:
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Naewon Lee
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Title:
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MULTI-STACK CHIP SIZE PACKAGING METHOD
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Assignment:
1
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MERGER AND CHANGE OF NAME
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| 891-10, DAECHI-DONG, KANGNAM-KU |
| SEOUL, KOREA, REPUBLIC OF 135-523 |
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| PILLSBURY WINTHROP SHAW PITTMAN LLP |
| E. RICO HERNANDEZ |
| 1600 TYSONS BOULEVARD |
| P.O. BOX 10500 |
| MCLEAN, VA 22102 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 891-10 DAECHI-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| PILLSBURY WINTHROP LLP |
| ERIC R. HERNANDEZ |
| INTELLECTUAL PROPERTY GROUP |
| P.O. BOX 10500 |
| MCLEAN, VA 22102 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 891-10, DAECHI-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF 135-523 |
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| PILLSBURY WINTHROP SHAW ET AL |
| P.O. BOX 10500 |
| 1650 TYSONS BOULEVARD |
| MCLEAN, VA 22102 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1650 TYSON?S CORNER |
| SUITE 1580 |
| TYSON?S CORNER, VIRGINIA 22102 |
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| PAGE CONNAGHAN |
| 4101 LAKE BOONE TRAIL |
| SUITE 300 |
| RALEIGH, NC 27607 |
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