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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/29/2006
Application #:
10742992
Filing Dt:
12/23/2003
Publication #:
Pub Dt:
08/12/2004
Inventors:
Yoshihiro Ogawa, Hisashi Okuchi, Hiroshi Tomita, Hiroyasu Iimori
Title:
ETCHING METHOD AND APPARATUS FOR SEMICONDUCTOR WAFERS
Assignment: 1
Reel/Frame:
015253/0688Recorded: 04/22/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/06/2004
Exec Dt:
01/06/2004
Exec Dt:
01/06/2004
Exec Dt:
01/06/2004
Assignee:
1-1 SHIBAURA 1-CHOME MINATO-KU,
TOKYO,, JAPAN
Correspondent:
FINNEGAN, HENDERSON, FARABOW, GARRETT &
LLP
1300 I STREET, NW
WASHINGTON, DC 20005

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