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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/24/2007
Application #:
10739456
Filing Dt:
12/17/2003
Publication #:
Pub Dt:
09/16/2004
Inventors:
Dae-Woo Son, Jin-Hyuk Lee, Kwan-Jai Lee
Title:
TAPE CIRCUIT SUBSTRATE HAVING WAVY BEAM LEADS AND SEMICONDUCTOR CHIP PACKAGE USING THE SAME
Assignment: 1
Reel/Frame:
014503/0849Recorded: 04/07/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/04/2003
Exec Dt:
12/04/2003
Exec Dt:
12/04/2003
Assignee:
416 MAETAN-DONG, YEONGTONG-GU, SUWON-CITY
KYUNGKI-DO,, KOREA, REPUBLIC OF
Correspondent:
MARGER JOHNSON & MCCOLLOM, P.C.
ALAN T. MCCOLLOM
1030 S.W. MORRISON STREET
PORTLAND, OREGON 97205

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