Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10391783
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Filing Dt:
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03/20/2003
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Publication #:
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Pub Dt:
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09/23/2004
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Inventors:
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Wen-Lo Shieh, Fu-Yu Huang, Chia-Chieh Hu, Ning Huang, Hui-Pin Chen, Chang-Ming Hsin et al
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Title:
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Package structure for a multi-chip integrated circuit
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9, CHUNG-SAN STREET |
N.E.P.Z. |
KAOHSIUNG, TAIWAN |
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WEN-LO SHIEH |
PO BOX 82-144 |
TAIPEI, TAIWAN |
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05/24/2024 10:25 PM
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