Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10752019
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Filing Dt:
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01/07/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Inventors:
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Masashi Otsuka, Chiaki Takubo
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Title:
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Semiconductor device assembled into a chip size package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU TOKYO,, JAPAN |
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| ERNEST F. CHAPMAN |
| FINNEGAN HENDERSON ET AL |
| 1300 I ST, NW |
| WASH DC 20005-3315 |
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