Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10766886
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Filing Dt:
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01/30/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Inventor:
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Tatsuya Usami
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Title:
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Semiconductor device having copper damascene interconnection and fabricating method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1753 SHIMONUMABE |
NAKAHARA-KU, KAWASAKI |
KANAGAWA, JAPAN 211-8668 |
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YOUNG & THOMPSON |
745 SOUTH 23RD STREET 2ND FLOOR |
ARLINGTON, VA 22202 |
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