Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/06/2007
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Application #:
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10403148
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Filing Dt:
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03/31/2003
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Publication #:
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Pub Dt:
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09/30/2004
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Inventors:
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William Louis Brodsky, Mark Kenneth Hoffmeyer, James R. Stack
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Title:
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METHOD AND STRUCTURE FOR IMPLEMENTING ENHANCED INTERCONNECTION PERFORMANCE OF A LAND GRID ARRAY (LGA) MODULE AND A PRINTED WIRING BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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IBM CORPORATION - DEPT. 917 |
ROBERT R. WILLIAMS |
3605 HIGHWAY 52 NORTH |
ROCHESTER, MN 55901-7829 |
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