Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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10811999
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Filing Dt:
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03/30/2004
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Publication #:
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Pub Dt:
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10/07/2004
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Inventor:
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Kenichi Shirasaka
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING A LEAD FRAME HAVING THROUGH HOLES OR HOLLOWS THEREIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1, NAKAZAWA-CHO |
| C/O YAMAHA CORPORATION |
| HAMAMATSU-SHI, SHIZUOKA-KEN, JAPAN |
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| DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP |
| STEVEN I. WEISBURG |
| 1177 AVENUE OF THE AMERICAS, 41ST FLOOR |
| NEW YORK, NY 10036-2714 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF THE RECEIVING PARTY ON A DOCUMENT PREVIOUSLY RECORDED AT REEL 015162 FRAME 0036.
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| 10-1, NAKAZAWA-CHO |
| HAMAMATSU-SHI |
| SHIZUOKA-KEN, JAPAN |
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| STEVEN I. WEISBURD |
| DICKSTEIN SHAPIRO MORIN & OSHINSKY |
| 1177 AVENUE OF THE AMERICAS |
| 41ST FLOOR |
| NEW YORK, NY 10036-2714 |
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