Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/25/2006
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Application #:
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10781876
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Filing Dt:
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02/20/2004
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Publication #:
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Pub Dt:
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10/07/2004
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Inventor:
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Cheng-Cheng Liu
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Title:
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MULTI-CHIP PACKAGE COMBINING WIRE-BONDING AND FLIP-CHIP CONFIGURATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, R.O.C., TAIWAN |
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TROXELL LAW OFFICE PLLC |
BRUCE H. TROXELL |
5205 LEESBURG PIKE |
SUITE 1404 |
FALLS CHURCH, VIRGINIA 22041-3401 |
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