Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10704637
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Filing Dt:
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11/12/2003
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Publication #:
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Pub Dt:
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10/28/2004
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Inventors:
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Hyeung-Gyu Lee, Youn-Seob Lee, Kyun Sunwoo, In-Soo Jeon
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Title:
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Package structure and sensor module using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TBI CENTER 152, #455-6, MASAN-RI, JINWI-MYON |
| PYUNGTACK-SI |
| 451-865, KYONGGI-DO, KOREA, REPUBLIC OF |
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| MCDERMOTT, WILL & EMERY |
| STEPHEN A. BECKER |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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