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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10690707
Filing Dt:
10/23/2003
Publication #:
Pub Dt:
11/04/2004
Inventor:
Takio Ohno
Title:
Method of manufacturing semiconductor device
Assignment: 1
Reel/Frame:
014641/0475Recorded: 10/23/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2003
Assignee:
4-1, MARUNOUCHI 2-CHOME
CHIYODA-KU, TOKYO, JAPAN 100-6334
Correspondent:
MCDERMOTT WILL & EMERY
STEPHEN A. BECKER
600 13TH STREET, NW
WASHINGTON, DC 20005-3096

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