Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10798235
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Filing Dt:
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03/10/2004
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Publication #:
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Pub Dt:
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11/11/2004
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Inventors:
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Ta-Ko Chuang, Sakae Tanaka
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Title:
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Method for bonding an integrated circuit device to a glass substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F. NO. 115 SEC. 3 |
| MIN-SHENG E. RD. TAIPEI, TAIWAN |
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| LADAS & PARRY |
| RICHARD P. BERG |
| 5670 WILSHIRE BOULEVARD #2100 |
| LOS ANGELES, CA 90036 |
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