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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/13/2006
Application #:
10847305
Filing Dt:
05/18/2004
Publication #:
Pub Dt:
11/25/2004
Inventors:
Hisatsugu Kurita, Masato Igarashi, Takeshi Senda, Koji Izunome
Title:
MANUFACTURING METHOD FOR A SILICON SUBSTRATE HAVING STRAINED LAYER
Assignment: 1
Reel/Frame:
015345/0123Recorded: 05/18/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/11/2004
Exec Dt:
05/11/2004
Exec Dt:
05/11/2004
Exec Dt:
05/11/2004
Assignee:
5-25, NISHI-SHINJUKU 7-CHOME
SHINJUKU-KU
TOKYO, JAPAN
Correspondent:
FOLEY & LARDNER LLP
RICHARD L. SCHWAAB
WASHINGTON HARBOUR
3000 K STREET, N.W., SUITE 500
WASHINGTON, D.C. 20007-5143
Assignment: 2
Reel/Frame:
019817/0749Recorded: 09/13/2007Pages: 17
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/01/2007
Assignee:
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU
TOKYO, JAPAN
Correspondent:
DAVID J. CUSHING - SUGHRUE MION PLLC
20-20, KAIGAN 3-CHOME, MINATO-KU
SUITE 800
WASHINGTON, D.C, DC 20037

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