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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7230323
Issue Dt:
06/12/2007
Application #:
10635245
Filing Dt:
08/05/2003
Publication #:
20040238921
Pub Dt:
12/02/2004
Inventors:
Yi-Shiung Lee, Chun-Yuan Li, Holman Chen, Shih-Tsun Huang, Chih-Yung Yun
Title:
GROUND-ENHANCED SEMICONDUCTOR PACKAGE AND LEAD FRAME FOR THE SAME
Assignment: 1
Reel/Frame:
014380/0983Recorded: 08/05/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEE, YI-SHIUNG
Exec Dt:
05/26/2003
LI, CHUN-YUAN
Exec Dt:
05/26/2003
CHEN, HOLMAN
Exec Dt:
05/26/2003
HUANG, SHIH-TSUN
Exec Dt:
05/26/2003
Assignee:
SILICON PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD
TANTZU, TAICHUNG HSIEN R.O.C., TAIWAN
Correspondent:
EDWARDS & ANGELL, LLP
PETER F. CORLESS
P.O. BOX 9169
BOSTON, MA 02209
Assignment: 2
Reel/Frame:
015135/0132Recorded: 03/26/2004Pages: 4
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME. PREVIOUSLY RECORDED ON REEL 014380 FRAME 0983.
Assignors:
LEE, YI-SHIUNG
Exec Dt:
05/26/2003
LI, CHUN-YUAN
Exec Dt:
05/26/2003
CHEN, HOLMAN
Exec Dt:
05/26/2003
HUANG, SHIH-TSUN
Exec Dt:
05/26/2003
YUN, CHIH-YUNG
Exec Dt:
05/26/2003
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3 DA FONG ROAD
TANTZU, TAICHUNG HSIEN, TAIWAN R.O.C.
Correspondent:
INTELLECTUAL PROPERTY GROUP OF
EDWARD & ANGELL, LLP
PETER F. CORLESS
P.O. BOX 55874
BOSTON, MA 02205

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