Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10602751
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Filing Dt:
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06/24/2003
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Publication #:
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Pub Dt:
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12/16/2004
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Inventors:
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Tai-Chun Huang, Chih-Hsiang Yao, Kang-Cheng Lin, Chin Chiou Hsia, Mong Song Liang
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Title:
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Hybrid copper/low k dielectric interconnect integration method and device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, L.L.P. |
| STEVEN H. SLATER |
| 17950 PRESTON RD. |
| SUITE 1000 |
| DALLAS, TX 75252-5793 |
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