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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/20/2007
Application #:
10859130
Filing Dt:
06/03/2004
Publication #:
Pub Dt:
12/23/2004
Inventors:
Naohiko Hirano, Nobuyuki Kato, Takanori Teshima, Yoshitsugu Sakamoto, Shoji Miura et al
Title:
MOLD TYPE SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
015427/0090Recorded: 06/03/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/07/2004
Exec Dt:
05/13/2004
Exec Dt:
05/07/2004
Exec Dt:
05/17/2004
Exec Dt:
05/09/2004
Exec Dt:
05/09/2004
Assignee:
1-1, SHOWA-CHO
KARIYA-CITY, AICHI-PREF 448-8661, JAPAN
Correspondent:
POSZ & BETHARDS, PLC
DAVID G. POSZ
11250 ROGER BACON DRIVE
SUITE 10
RESTON, VA 20190
Assignment: 2
Reel/Frame:
016277/0131Recorded: 02/17/2005Pages: 4
Conveyance:
RECORD TO CORRECT THE 6TH CONVEYING PARTY'S NAME, PREVIOUSLY RECORDED AT REEL 015427, FRAME 0090.
Assignors:
Exec Dt:
05/07/2004
Exec Dt:
05/13/2004
Exec Dt:
05/07/2004
Exec Dt:
05/17/2004
Exec Dt:
05/09/2004
Exec Dt:
05/09/2004
Assignee:
1-1, SHOWA-CHO
KARIYA-CITY, AICHI-PREF. 448-8661, JAPAN
Correspondent:
DAVID G. POSZ
POSZ & BETHARDS, PLC
11250 ROGER BACON DRIVE
SUITE 10
RESTON, VA 20190

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