Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10820855
|
Filing Dt:
|
04/09/2004
|
|
Publication #:
|
|
Pub Dt:
|
12/30/2004
| | | | |
|
Inventor:
|
Min-Lung Huang
|
|
Title:
|
Under bump metallization structure of a semiconductor wafer
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 26 CHIN 3RD RD. |
| NANTZE EXPORT PROCESSING ZONE |
| KAOSHIUNG, TAIWAN R.O.C. |
|
|
|
|
| BACON & THOMAS, PLLC |
| 625 SLATERS LANE |
| FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
|
|
Search Results as of:
06/19/2024 10:24 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
