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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10846011
Filing Dt:
05/14/2004
Publication #:
Pub Dt:
12/30/2004
Inventors:
Robert Malanga, John P. Lasek, An Huu Nguyen, Toan Van Mai, Frank W. Oropeza et al
Title:
Thermal transfer container for semiconductor component
Assignment: 1
Reel/Frame:
015396/0824Recorded: 11/22/2004Pages: 13
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/08/2004
Exec Dt:
03/08/2004
Exec Dt:
03/08/2004
Exec Dt:
03/08/2004
Exec Dt:
03/08/2004
Assignee:
201 MERRITT 7
P.O. BOX 5201
NORWALK, CONNECTICUT 06856
Correspondent:
BINGHAM MCCUTCHEN LLP
JULIE TAMBURO
150 FEDERAL STREET
BOSTON, MA 02110
Assignment: 2
Reel/Frame:
015673/0629Recorded: 08/12/2004Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/01/2004
Exec Dt:
06/21/2004
Exec Dt:
06/22/2004
Exec Dt:
06/22/2004
Exec Dt:
07/27/2004
Exec Dt:
08/04/2004
Assignee:
1101 ENTERPRISE DRIVE
ROYERSFORD, PENNSYLVANIA 19468
Correspondent:
ALLEN DYER DOPPELT, ET AL.
RICHARD K. WARTHER, ESQ.
255 S. ORANGE AVENUE
P.O. BOX 3791
ORLANDO, FL 32802

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