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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/28/2006
Application #:
10899870
Filing Dt:
07/27/2004
Publication #:
Pub Dt:
02/10/2005
Inventors:
Hung-Ta Hsu, Tzu-Bin Lin, Ya-Ling Huang
Title:
FLIP CHIP PACKAGE STRUCTURE
Assignment: 1
Reel/Frame:
015638/0912Recorded: 07/27/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/21/2004
Exec Dt:
06/21/2004
Exec Dt:
06/21/2004
Assignee:
NO. 26, JINGSAN RD.
KAOHSIUNG, TAIWAN 811, R.O.C.
Correspondent:
THOMAS, KAYDEN, HORSTEMEYER & RISLEY LLP
DANIEL R. MCCLURE
100 GALLERIA PARKWAY, SUITE 1750
ATLANTA, GA 30339-5948

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