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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/07/2006
Application #:
10643043
Filing Dt:
08/18/2003
Publication #:
Pub Dt:
02/24/2005
Inventors:
Scott D. Brandenburg, Bruce A. Myers
Title:
ELECTRONIC ASSEMBLY WITH SOLDER-BONDED HEAT SINK
Assignment: 1
Reel/Frame:
014408/0946Recorded: 08/18/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/12/2003
Exec Dt:
08/12/2003
Assignee:
P.O. BOX 5052
LEGAL STAFF - MAIL CODE: 480-410-202
TROY, MICHIGAN
Correspondent:
DELPHI TECHNOLOGIES, INC.
STEFAN V. CHMIELEWSKI
P.O. BOX 9005
LEGAL STAF MC CT10C
KOKOMO, IN 46904-9005
Assignment: 2
Reel/Frame:
045115/0001Recorded: 01/23/2018Pages: 22
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/29/2017
Assignee:
ERIN COURT, BISHOP'S COURT HILL
ST. MICHAEL, BARBADOS
Correspondent:
DELPHI TECHNOLOGIES IP LIMITED
5825 INNOVATION DRIVE
LEGAL STAFF - M/C 480-415-154
TROY, MI 48098

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