Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10959098
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Filing Dt:
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10/07/2004
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Publication #:
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Pub Dt:
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03/03/2005
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Inventor:
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Ho-Young Lee
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Title:
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Solder-fill application for mounting semiconductor chip on PCB
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 56-1, SHINLIM DONG, KWANAK GU |
| RM #302-427 MECHANICAL & AEROSPACE ENGINEERING |
| SEOUL, KOREA, REPUBLIC OF 151-741 |
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| G W I P S |
| PETER T. KWON |
| KANGNAM P.O. BOX 2301 |
| SEOUL 135-242, REPUBLIC OF KOREA |
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